Momentum Modbus Plus 170 PNT Series Guia do Utilizador Página 36

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Overview of TSX Momentum M1 Processor Adapters
24
870 USE 101 00 V2.2
171 CCC 760 10,
Continued
Specifications,
Continued
Mechanical
Weight 42.5 g (1.5 oz)
Dimensions (HxDxW) 25.9x61.02x125mm
(1.01 x 2.37 x 4.86 in)
Material (Enclosures/
bezels)
Lexan
Operating Conditions
Temperature 0 ... 60 degrees C
Humidity 5 ... 95% (noncondensing)
Chemical interactions Enclosures and bezels are made of Lexan,
a polycarbonate that can be damaged by strong
alkaline solutions
Altitude, full operation 2000m (6500ft)
Vibration 10 ... 57Hz @ 0.075mm displacement amplitude
57...150Hz @ 1g
Ref. IEC 68-2-6 FC
Shock +/-15g peak, 11ms, half sine wave
Ref. IEC 68-2-27 EA
RFI Susceptibility/
immunity
Meets CE mark requirements for open equipment.
Open equipment should be installed in an industry-
standard enclosure, with access restricted to qualified
service personnel.
Ref. IEC 801-3: 80 ... 1000 MHz, 10 V/m
Ref. IEC 1000-4-3, EN 50140 Criteria A
Storage Conditions
Temperature -40 ... +85 degrees C
Humidity 5 ... 95% (noncondensing)
Safety Parameters
Degree of protection Unintentional access (UL 508 Type 1, NEMA250 Type 1,
IP20 conforming to IEC529)
Di-electric strength RS232 and I/OBus are non-isolated from logic common
Ground continuity 30 A test on the exposed metal connector
Agency Approvals
UL 508, CSA, CUL, CE
FM class1, div2 pending
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